PEEK LDS (laser direct structuring) filament
As a specialist for highly modified materials and solutions in all kinds of industries we provide a new solution for 3D printing PEEK plastic for the electronic industry. Being worldwide the only certified supplier by LPKF Laser & Electronics AG we offer a PEEK filament modified by a laser direct structuring (LDS) feature. Together with our own compounding department and its extensive experience with materials for laser direct structuring, we were the first company in the world to develop a PEEK filament with LDS feature.
The MID (Molded Interconnect Devices) process and the conductor paths created on the application allow both functional and fixed components such as smartphone housings with integrated antennas to be combined. The metallisation properties of our TECAFIL PEEK LDS black are comparable with injection moulded PEEK LDS compound, despite a rougher surface due to additive manufacturing - as confirmed by the Hahn Schickard Institute of Engineering.
Why use PEEK 3D printer filaments with LDS?
PEEK filament prices are relatively high compared to standard or engineering plastics. But with the ideal properties of PEEK filaments in terms of high thermal stability, good adhesion, weld line strength, and good chemical resistance, printing PEEK filaments offers enormous advantages and, unlike other 3D printer filaments, opens up a completely new range of applications.
The heat resistance of PEEK filaments allows PEEK with LDS feature reflow soldering and application assembly. In addition, plating by hole bonding is also possible with LDS PEEK 3D filament.
So this PEEK filament offers enormous advantages for LDS components, as functional prototypes and small series can be produced with a 3D printer without the need to invest in an injection moulding tool. PEEK LDS is generally known for applications such as sensors, antennas or security applications.
Find further details on laser direct structuring plastics: https://www.ensingerplastics.com/en/compounds/laser-structuring
|Filament diameter||1,75 mm|
|Filament diameter tolerance||±0,05 mm|
|Spool diameter||200 mm|
|Spool take up||52 mm|
|Spool width||55 mm|
|Max. melt temperature||430°C|
|Print bed temperature||130-150°C|